In keeping with its futuristic approach to technology, Samsung recently announced its decision to mass produce the world’s first high density ePoP (embedded Package on Package) memory modules for its high-end smartphones and tablets. For those who do not know ePoPs are single memory packages that group the controller, DRAM, and NAND flash into one chip that can be stacked above an application processor, thus conserving space.
While it may not sound like much, the newly launched ePoPs may be grouped into packages with APs taking up as much as 40% less space leading to slimmer handset designs and a host of other perks including higher capacity and reading speeds.
According to Jeeho Baek, Senior Vice President of Memory Marketing at Samsung Electronics:
“By offering the new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features. Samsung also plans to expand our line-up of ePoP memory with packages involving enhancements in performance and density over the next few years, to further add to the growth of premium mobile market.”
This technology has actually been around for some time but was limited to wearable devices only, but with Samsung’s new drive to join the new component into more powerful hardware, such as smartphones and tablets we can expect even more compact devices with better performance and storage.